I2SL Laboratory Resilience Guide: A Framework for Resilience in Research Facility Design and Operations
June 17, 2021
1 p.m. – 2 p.m.
I2SL has just released the new Laboratory Resilience Guide co-authored by Lisa Churchill, Climate Advisory; George Karidis, SmithGroup; and Jacob Werner, Perkins&Will. During this webinar, Jacob and George will provide an overview of the guide and describe key components, including: a high-level framework for resilience, applications for laboratories, planning and design considerations, a quick start checklist, and laboratory resilience case studies. We welcome your questions, comments, and suggestions—especially more case studies. Help improve the resilience of laboratories worldwide!
- Understand the concept of resilience;
- Learn how to apply a resilience framework to laboratories;
- Learn how to use the I2SL Laboratory Resilience Guide; and
- Review laboratory resilience case studies.
Register for the webinar today.
Jacob Werner is a Senior Project Architect with Perkins & Will's Boston studio, specializing in laboratory design. Jacob is an advocate for sustainable design. He is a LEED AP, WELL AP, Passivehouse Consultant, and ILFI Ambassador. He is a leader in the I2SL New England chapter and the I2SL Lab Benchmarking Committee. Jacob has spoken extensively about both sustainability and laboratory design at Tradeline, I2SL, and BuildBoston. A natural teacher, he taught design at the Boston Architectural College.
George Karidis, PE, LEED BD+C, is a Vice President and Design Director for SmithGroup, specializing in high-technology facilities and low-entropy engineering design. He is member of ASHRAE, I2SL, and the Engineering Society of Detroit, and serves on Lawrence Tech’s Architectural Engineering Advisory Board. George co-authored the SmithGroup whitepaper, “Climate-Informed Increases in HVAC Relative Humidity May Help Fight COVID-19 and other Pandemics,” cited by ASHRAE for climate visualization tools. His innovative designs have received two ASHRAE Technology Awards and one U.S. Patent.